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TCOB(MCOB2th) Technology

LED light Evolution

.1962 First Commercial Red LED
.1971 Green Orange and Yellow LEDs are available
.1981 High Effective AIGAIS diodes outperform filtered light bulb’s efficacy
.1993 Efficient Blue Led comes into lighting public market
.1994 Doubling of the light yield by Hewelett Packard
.Today Commercial Luminance Efficacy of more than 140 lm per watt
.Future DIP Led packaging will bring the lighting market into another bright world
tcob

Led lighting Technology, TCOB MCOB2th
Now,Based MCOB led technology, We cooperate with Chinese Academy of Science and Germany high-end crystal material institute. improve our MCOB technology, We call it TCOB or TMCOB or MCOB2th.our new technical can ensure:
new led light technology TCOB 2th MCOB

1.When Thorn bad 1pcs led chip,just failed 1 pcs chips,no effect other chips working,another chips also working good,and you can no feel any dark with eyes.
2.we do not use AG coating again (PHILIPS led technology and we use this technology till now), it ensure our led after thousands hours use time,never appear bad light phoenomenon and lighting decay.
Our factory cover more than 80.000㎡ and more than 1500 Employes.our led lighting pass CE, ROHS,TUV,FCC… Certificates.Welcome visit our factory.

Before,Our MCOB led technology is good enough (more than 130lm/w,most bright and most smooth lighting in market).but:
led lamp technology TCOB 2th MCOB

1.When thron bad 1pcs led chip,aound the failed chip will be dark from eyes.
2.As use AG coating(for 99% led industry use it),after thousands lighting,the led will appear bad light phoenomenon and lighting decay.some SMD led light will more than 30% decay after 5000 hours.

Compare TCOB (MCOB2th,TMCOB) with MCOB , you will find :
white led technology TCOB 2th MCOB

The 5th Generation of LED lighting technology, TCOB ( Top chips on Board, also called RCOB=Ring chips on Board)
Wanban Patented TCOB Package Structure.
Top view
Single Layer Crystal Ceramic Plate
Led chips mounted directly on Crystal Plate
Up to 140-188lm per watt luminous efficacy
Reaches 97% heat dispersion

(Multi Cups/Chip on Board) MCOB LED Lighting Technology

mcob
As we know about that, most of COB encapsulation technologies, including the one of Japan, are based on the encapsulation of the aluminum base, which assemble some chips to be encapsulated on the aluminum base. This is what we call the COB technology. The substrate of the aluminum is copper foil, which can only well conduct electric but it can’t process optical processing very well.
mcob 1LED lighting source encapsulation of Convex Structure

11: Metal die casting base (6 reflective cups) with plated relector layer.
12: LED Chip
13: Insulated glue (Mixing layer of glue and phosphor)
14: Mixing layer of glue and phosphor on surface
15: Reflective Cup (Round with LED dies sticked by insulated glue)
16: Circuit board
17: Cutout
18: Reflective layer (Silver plating layer)
19: Wire: (LED chips connected to Circuit Board)

MCOB technology opens up new competitive advantages for LED light sources.

Feature of the lamps is MCOB (Multiple Chip Cups On Board) technology, the effect of which amounted to more than 100 – 110 lumens / watt. that can significantly improve the cooling of the LED crystals and increase the efficiency of the lamp. Lamps series.
MCOB LED technology, quite distinct from the traditional technology

puts the chips in the optical cups according to optics.
It aims to make not only one cup, but many cups. It derives from a simple principle,
i.e., the light of LED is from the chip itself, which means we need many angles to let out more light.
The light efficacy can be improved if we have more light exits. In any cases, the light efficacy of low poweres chips can be at least 15% higher than high poweres chips.
The reason is that the chips of high power are bigger and they only have four light exits.
However, we can have as many as sixteen small chips on a board and 4*16 light exits.

Advantages of the technology LED MCOB

Lower cost of LED devices and increase the efficiency of their work.
Innovational develop LED MCOB allow to achieve high brightness of the light flux, even at small sizes of lighting equipment.
Manufacturing operations is reduced by half compared with the technology of SMD, significantly reduced production time of LED devices.
High optical density of the chip: 1 cm2 area of the substrate can be set to 70 chips.
Long lifetime of LEDs MCOB, reliability and efficiency of heat transfer led-devices..
Remarkable brightness of the light flux, the lack of effect of shadows.
Compact type, small size.

Installation of MCOB LED technology: the main production stages

Die bonding
Surface cleaning to remove dirt.
Ultra thin pure 99% gold conductors, thickness of several microns.
Crystal silicon with a phosphor uniformly dispersing the heat from all the faces of the crystals before the main heat sink.

LED Technology
LEDs are light emitting opto-electronic semiconductor components. Since decades, they are used in the field of man-machine communication to convert electrical signals into visual information.

Typical LED applications encompass household appliances, telecommunications, life sciences and signal technologies. Moreover, due to its low power consumption and excellent operational reliability LED technology partly replaces conventional lighting solutions already today.

The development of LED technology progresses at rapid pace, as light efficiency (Lumen/Watt) increases, colour qualities improve and temperature ranges get manageable. Consequentially, new territories of applications will open up, especially in the field of standard lighting.

Based on their structure, LEDs can be split into quattuor groups:
Light Technology

Light technology. covers the generation and application of light as well as lighting technology and methods and processes of light evaluation, i.e. the measurement of light-related parameters; these include illuminance, luminance, and luminous intensity.
Illuminance Ev

Illuminance Ev is defined as the areal light flux density on a lighted area hit by the luminous flux Fv. Illuminance is measured in lux (lx=lm/m2), where luminous flux and area are put in as [lm] and [m2], respectively. Based on the illuminance Ev, a specific lighting solution can be calculated and designed.

Luminance Lv

Luminance is defined as the areal density of luminous intensity of a light emitting or reflecting area which radiates the luminous intensity Iv at a given angle. Luminance Lv is measured in [cd/m2].
Luminous intensity Iv

Luminous intensity Iv [cd] is among the key parameters describing an LED or LED display. It is defined as the luminous flux emanating from a point source within a solid angle W (steradian) into a particular direction. Hence, luminous intensity is the directional luminous flux Fv within a solid angle W. Today’s LEDs achieve a luminous intensity of Iv=10 cd or more. As intensity depends on the radiation angle, an LED chip equipped with a 30° reflector achieves a higher luminous intensity than an identical LED chip with a 60° reflector. That is, using a 60° reflector the same luminous flux Fv has to illuminate a larger area than using a 30° reflector.

In addition to these parameters, VS Optolelectronic’s in-house photometric laboratory is equipped to analyse all photometric, colorimetric and radiometric characteristics. Two in-house Gonio spectrum radiometers exactly determine the radiation characteristics of LEDs and LED light modules of up to 350 mm Φ.

LED – Light Emitting Diode Basics

LEDs are electronic devices. When current flows through the diode in the pass-through direction, it emits light.

The LED was invented in 1956, and has been in industrial use since 1970. However, until recently red, yellow and green LEDs were mainly used.

White LEDs were introduced in 1995. They are manufactured by luminescence conversion. In this process, a blue LED is coated with yellow phosphor in order to produce white light. The amount of phosphor influences the color temperature. The thicker the phosphor layer, the warmer the light.

LED Phosphors

White LEDs are made by coating them with a phosphor that absorbs a proportion of the blue light emitted by the diode and emitting light across the rest of the visible spectrum. Typically one or two phosphors are used to convert the blue to white. Either a single broad yellow phosphor or a combination of green and red will produce the desired effect.
led phosphors

LED chip is the basic component

The LED chip is the basic component to generate light with the help of semiconductor technology. It is a semiconductor component made from two crystal layers of different doping. One of these crystal layers is referred to as the p-doped (p+) layer, the other one as the n-doped (n-) layer. A light emission is generated at the barrier junction of the pn transition during current flow in conducting direction, i.e. with the anode (p+) connected to the plus terminal and the cathode (n-) connected to the minus terminal.

Benefits of LED

Very low power consumption
Low heat generation
Long life (up to 50,000 hours)
Low maintenance cost
Mercury-free
No UV radiation
Small design
Precise light guidance
Very good color rendering properties
led bulb replacement technology

Service life – L70

As soon as the light current has fallen back to 70% of the original value, the light has reached the end of its useful service life.

The guaranteed service life of an LED is at present up to 50,000 hours.

The service life is greatly influenced by the operating temperature of the LED. It is therefore important when manufacturing LED lamps to achieve a correct balance between power output and cooling in order to ensure long life.led life span

CRI – Color Rendering Index

The Color Rendering Index (CRI), also termed the Ra value, indicates how true the colors in the light are.
Bulbs CRI : 100
Fluorescent lamps CRI : 70-90
Halogen metal vapor lamp CRI : 60-95
Mercury vapor high-pressure lamp CRI : 45
Sodium vapor high-pressure lamp CRI : 18-30
MCOB LED lamps CRI : 80

The maximum of 100 corresponds to natural daylight.led cri

Color temperature

The color temperature is a measure of the color impression made by a light source; its unit is the Kelvin (K).

Warm/yellowish light colors have a low color temperature. The cooler/more blueish the light color, the higher the light temperature.led color temperature

Advantages of LED

In comparison to lamp systems, the single wavelength and lower power of LED do limit how and where it can successfully be used, but for applications that are suited to it, LED offers some great advantages:

High Durability and lasts > 20,000 Hrs.
Controller has a small form factor and can independently control multiple heads
Last much longer than lamps leading to less continuous replacement, thereby can be more cost effective.
Contain no mercury and consume less power (“green”)
Instant ON/OFF
Small control box and more flexible heads (vs. fiber liquid light guides)
Narrow wavelength which is great for applications that don’t require additional wavelengths
Relatively stable power output throughout the life of the LED
Relatively slower degradation when compared to conventional arc lamps
Limitations of LED
Narrow Wavelength

Many UV curable adhesives, sealants and substrates require additional wavelengths for effective curing.
Narrow Beam Profile
The power of an individual LED is focused on a very small area. Irradiance UVA levels similar to arc lamp systems can be achieved but only over a very small diameter (1-2mm).
Lower Optical Power
Optical power of a UVA LED is < 20% of the comparable optical power of a typical UV lamp and is getting closer.

Typical LED Challenges

Insufficient power for larger spot sizes.
Insufficient intensity (over entire spot) leading to surface tackiness.
Insufficient spectrum for effective curing and/or depth of cure.
Commercially available adhesive suitable for lamp based systems do not always react well with monochromatic wavelength of the LED source.
Lower speed of cure.

LED Vs Lamp
Whether or not LED can be used for a particular application will depend on the following:

Availability of an adhesive suitable for the application that cures well at 365nm and doesn’t require additional wavelengths.
Small spot size (typically no more than 3-5 mm).
Low cure depth requirement.

LED best suited where:

365nm is the dominant required wavelength.
Cure area is relatively small.
Cure depth is low or not critical.
Potential surface tackiness is acceptable.

Comparison Chart
led vs cfl

Swift Evolution of the LED
No evolution of any lamp was as dynamic as the one of the light emitting diode (LED). Since the first commercial available LED in 1962 the efficiency multiplied every decade.

This rapid evolution leads to the problem of documenting the state of the art. Professionals don’t expect the increase of efficiency to break off within the near future. This will lead to a clear LED-dominance within the lighting technology. LEDs with more than 160 Lumen/Watt have already been developed but are not yet available on the market. Practical every year new LED-innovations are presented which enhance the efficiency even further.

Aladdin as an expert for special solutions offers its customers always an up to date and very efficient lighting, this is possible because of the high flexibility of our production, which allows for a fast and easy integration of technical innovations.

Comparison of Light Yield

The light yield describes the relation between incorporated electrical energy and the light flux radiating from the light source. This value is getting represented in lumen/watt.

This high efficiency results from the LED’s functionality. Within the LED the light emerges by emitting photons with a effectiveness of almost 100%. Unfortunately this is not the only factor determining a light’s effectiveness. A loss of power is affiliated to the emerge of the light from the depletion layer within the semiconductor.

Absorption, as well as reflection, are physical effects you need to consider. These reduce the efficiency to about 30%. Compared to a regular light bulb (5%), this value is still very high.

A further advantage over other lamps becomes apparent when looking for a specific light colour. For example, for incandescent lamps the desired colour is achieved by a colour filter, which absorbs the major part of the broad colour spectrum and transmits only one colour. On the other hand an LED generates monochromatic light directly. This allows producing the colour you want to achieve without further loss in efficiency.

Due to the high efficiency of LEDs the energy consumption is reduced. This results in less operating costs and a smaller CO2footprint. With Aladdin LED-Solutions you illuminate not only economically you also protect nature.

Aladdin always states the light yield in terms of the overall system. Therefore the efficiency refers to the luminaire and is declared in luminaire lumens / watt.
Durability and its Determination with LM-80 & TM-21

At constant conditions the light output of an LED decreases continuously in the course of time. This behavior, which is also known as degradation results from the migration and expansion of defects in the crystal lattice of the diode. An abrupt failure similar to light bulbs does not occur as long as the LED is actuated properly.

The following chart shows the lifetime of light sources compared, taking the lamp light depreciation over time into account.
Apples and oranges

If you want to make qualified comparisons between LED luminaires and luminaires comprising compact fluorescent lamps, you should first ensure that the products to be compared exhibit approximately the same light technical data. Besides the beam angles, the luminous flux of the luminaire is an essential factor in this observation, as this ensures that the lighting task is equally fulfilled.
mcob led bulb
led bulb development
The service life of LEDs is usually indicated by the manufactures in the form of “L70 (9k) >50.000”. This expression refers to the lowering of the LED light output to 70% after a minimum of 50.000 hours, based on a 9.000-hour test series.

Two standards have internationally prevailed to obtain this lifetime. First, the LM-80 test method, on the other hand, the calculation method TM-21.

The LM-80 process is a pure life test in which the light output is recorded versus the time for three different housing temperatures. The minimum duration of the test is 6000 hours.

TM-21 on the other hand is not a test but a method of extrapolation that is a projection. For this, the LM-80-determined values ​​are used and a prospective light decline is calculated. The method is limited to the six-fold test time of the LM-80 test. So when 50,000 hours or more are provided by the TM-21-process the lamps must have been tested for over 8.000h.

Most times the lifetime is indicated by the L70-Value, which describes the amount of time until only 70% of the luminous flux remains. Sometimes the manufacturer states the calculated light yield at 50,000 operating hours. For the Aladdin Nero Accent LED module still remain 82% of the original light output for example (L82(9k)=50.000h).

Rapid Amortization of LED Solution

While LEDs are more expensive to buy than conventional lighting, a payback calculation shows how quickly the investment pays off.

Not only the sharp drop in electricity cost is important, you also have to take the falling change and maintenance costs attributable to the long lifetime into consideration.

That’s why the switch to LED solutions frequently pays out even for projects completed in the past. A required lights change is assisted by the standardized design of Aladdin lights which will facilitate installation.

We are also happy to calculate the payback period for your specific project and show you how quickly the use of LEDs pay for itself. We can calculate your savings using the indication of your current price, the maintenance and the respective operating hours.

Types of LED

T-type LED

t type ledThe T-type LED is the righinal style Because the sealed casing does not allow heat to dissipate, this style is not suitable forhigh luminous power applications, but only as a signal/readiness indicator.

SMD – Surface Mounted Device
smdWith the SMD, Surface Mounted Device style, the component is adhered directly to the printed circuit board. the output ranges differ considerably here. On many LED with a small single-power source, series resistors can be accommodated in the luminaire, and connected in parallel to constant-voltage LED transformers (similar to halogen luminaires).
smd 1

SMD – High output LED
smd high powerWith the SMD type of individual high output LED (here an example of a luminaire with an energy efficiency of approx . 50 lm/w developed in 2003), the luminaires should be connected in series to constant-current LED transformers (unused sockets must be provided with short-circuit plugs).smd high power 1

SMD – High power LED

smd 2With the new high power SMD style LED (here an example of a luminaire with an energy efficiency of 80-100 lm/w developed in 2008) the luminaires should also be connected in series to constant-current LED transformers (unused sockets must be provided with short-circuit plugs).

Types of Light Guides

Both liquid light and fiber light guides exhibit their own unique attributes for the relevant curing applications.

Moderate cost
High transmission capability
3, 5, and 8mm tip diameters from most manufacturers
Can be coupled to custom optics
Degrade over time
2,000 – 4,000 hour life
Have a “shelf life”
Extended range version required for transmission below 300nm
Multi-legged versions require daily balancing
Economical choice for light delivery
More challenging to customize

Quartz Type / High Power Type

Up to 50% more output than standard fiber guides
30% more output than bifurcated liquid guides
+/-5% balanced output in multi-legged light guide
Higher packing fraction
Very long life
Greater flexibility in curing process
High power transmission
Provides 25%- 50% more throughput allowing more energy from lamp
Moderate cost
No balancing required
High numerical aperture fiber that can gather 42 degrees of light as compared to 25 for a standard fiber guide
Do not degrade over time
Very durable and does not degrade over extended UV light transmission
Unlimited shelf life
Available in 1, 2, 3, and 4 legs
Transmits wavelength from 160-1200nm eliminating the need for extended range light guides
Can be coupled to custom optics
Easier to customize

Peak Irradiance Fall-Off

Also referred to as power density, irradiance is the amount of power delivered into a specified area, i.e. energy/time/area. Units are measured: J/sec/cm2 = Watts/centimeter2(W/cm)
leds new technology Peak Irradiance Fall-Off

Near Field Beam Profiles

Beam profiles display a bell-shaped or Gaussian irradiance distribution at the focal point. As you move further away from the center of the beam the irradiance decreases: the larger the diameter of the beam, the lower the irradiance. However, as you increase the diameter of the beam the total amount of light increases therefore the total power increases.
Beam Profiles – typical 5mm light guide
led chip technology Near Field Beam Profiles

Beam Propagation
A beam of light is a bundle of light rays that may be parallel, converging or diverging. This directional nature of propagation is known as the intensity distribution of the bundle of light.
new led light technology

Light Line Beam Profiles

The Light Line Beam profiles illustrate the pattern of light delivered through a Fiber Light Line. The profiles illustrate the two key axes of measurement which can enable optimal light delivery for the target.
light emitting diode technology

COB (Chip on Board) LED Technology
Chip on Board (COB) LED Lighting technology

The greatest power densities on the smallest space are often the basis for unique selling points of various products on the market. These criteria can be realized by the ( Chip on Board ) COB LEDs technology.

Direct contacting of the semiconductors (LEDs) on PCBs allows for optimal thermal management, high packaging density and thus long-lasting and high-performance COB LED modules.

(Chip on Board) COB LED technology

With this technology, the LED chips are in the form of a semiconductor chip, which is neither encased nor connected. The semiconductor chip is described as a “Die”. This LED chip is processed by means of a special procedure which is called “Die Bonding”. Here the individual chips are placed on the PCB and using the Wire Bonding method, connected to the contact surface of the PCB, which are described as “Pads”. Gold wires in the micrometer range are used for contacting. The COB LED light technology allows for virtually limitless freedom of scope for the PCBs and thus serves as the basis for totally unique LED solutions.
what is led technology

The Chip-on-Board LED Module

LED technology offers better color mixing and simplified thermal management for backlighting large LCD displays.

Conventionally, LED chips have been mounted on substrates to create discrete LED components, which were attached to a printed circuit board. The solder reflow process typically used to attach the component to the circuit board subjects the LED chip to a substantial amount of heat that easily can damage the chip or degrade its performance. Hence, tight (and, therefore, expensive) process control is required for this type of assembly. In fact, the substrate cost is almost invariably the second-highest in an LED component, exceeded only by the cost of the chip itself.

A different approach, called chip-on-board packaging, seems capable of meeting all the requirements of backlighting. This method mounts the LED chip directly onto the printed circuit board using a conductive adhesive, which helps reduce costs by eliminating the substrate and complicated solder reflow assembly process. In addition, direct attachment can reduce the pitch between LED chips from the conventional 5 mm to approximately 2 mm and can lower the overall height of the light source (Figure 1).
led lights technology

Figure 1. By mounting the LED directly onto the printed circuit board, a substrate is unnecessary, so pitch is reduced from 5 mm to approximately 2 mm.

Decreasing the LED pitch reduces the color-mixing area required (Figure 2), which means that the area of light loss is smaller. To achieve high coupling efficiency from the light source to the lightguide plate, a reflector is incorporated into the chip-on-board package to produce an oval radiation pattern. A narrow radiation pattern on the X-axis allows more light to enter the lightguide plate, whereas a wider radiation angle on the Y-axis enhances color mixing.
led lamp technology

Simple thermal management
A metal core printed circuit board is used in the package to provide a low thermal resistance, allowing heat generated by the LED chip to be transferred to the heat sink via the shortest possible thermal path (Figure 3), which increases the life span; moveover, the heat transfers more efficiently through three layers than through five. The chip-on-board packages are mounted directly onto the back metal (with thermal compound at the interface), so that the heat generated by the LED chips spreads efficiently on the large metal frame for efficient dissipation without additional heat sinking. In the demonstration configuration, the entire backlight unit can maintain a temperature below 60°.
led lamps technology
Figure 3. In comparison with the conventional approach, the thermal path is reduced. (DA = die attach, MCPCB = metal core printed circuit board.)

When compared with assemblies using conventional discrete LED packages, a chip-on-board approach can be compared with RGB LED-based LCD backlighting.

The chip-on-board leds packaging has a thin outline, it produces better color mixing, and it requires simple thermal management and potentially lowers costs, all of which better match the requirements of customers. In addition, assembling a complete backlight using the chip-on-board led package is similar to that using today fluorescent lamps, which makes a changeover relatively simple.

COB LEDs for directional

In order to preserve a pleasant and uniform light environment, directional and decorative lighting applications require a light source that meets several key criteria. It should be compact, have a high efficiency with sufficient light output, a high colour rendering index (CRI), a high colour uniformity and colour consistency and a long service life. The light source should also be easy to implement into the application at an acceptable price for the user or the consumer.

A lot of different types of LEDs are available for lamp and lighting manufacturers. For a long time, standard discrete components such as high power LEDs or, alternatively, more cost effective PLCC package LEDs in the small and medium power range played the dominant role. Meanwhile, however, chip-on-board (COB) LEDs successfully serve the requirements of this application segment and specifically address design and performance issues. Typical applications mainly include downlights, spotlights and retrofits such as MR16, GU10 and PAR lamps as well as decorative lamps such as candle lights.
diode technology

Figure 1: 15W COB including internal electrical configuration.
Setup of chip-on-board LEDs

Conventional SMD LEDs mostly consist of a single or maximum two LED chips. Chip-on-board LEDs, however, are based on a multi-chip assembly with many individual low power LED chips connected in series and in parallel. Mechanically, the COB can be mounted directly on the lamp heat sink, eliminating the SMT processes required by traditional discrete components on an MCPCB. This provides more direct thermal dissipation, higher efficacy, and ease of assembly.
Typical specifications

The table shows typical specifications of COBs within the power range from 4W to 15W vs. established High Power LEDs at 1W and Mid Power LEDs at 0.5W. COBs in particular are characterized by much higher luminous fluxes, higher electrical parameters as well as by their larger emission surfaces (apertures) and dimensions.
technology led

LED lighting technology comparison

MCOB LED Comparison COB LED Comparison High power LED Comparison SMD LED Comparison T-type LED Comparison
Single Layer Aluminum Plate Big LED Chip on 3 Layers Plate High Power Chip on 3 Layers Small LED Chip on LED Pin On PC Board

100 lm/w – 140 lm/w

70 lm/w – 90 lm/w

60 lm/w – 80 lm/w

70 lm/w – 90 lm/w

60 lm/w 70 lm/w

Silicone Chips are applied directly on the aluminum plate allowing for up 97% heat dispersion

with IC-tpye Power Supply

Larger silicone Chips are welded the same way as on the 2nd generation surface mounted device, with 50% heat dispersion.

with 2or4 pins welded on single-sided PCB. Patent of LumiLED for multi-angle emission by optical lens .

Most of high power chips are called “Copy LumiLED”

Silicone Chips are welded on to a 3layers aluminum plate resulting in higher cost with only 50% heat dispersion.

Lighting Structure is made up of many pins on a PC board to achieve good lighting effect but with poor heat dispersion from multiple pin.

LED Chips Manufacturers

As the core unit, LED Chips technology’s development leads the direction of LED Lighting market. Currently there are 3 groups in this market,performing “Matthew effect”.

The first Group: (Japan,Europe,America as the representatives)

5 biggest Chips Manufactuerers: Philip/Lumileds(Netherland), Cree(America), Nicha(Japan), Toyoda Gosei(Japan), Osram(Germany), Also Sharp ,Toshiba, Panasonic included.

The Second Group: (Taiwan, Korea as the representatives)

Sanan ——- Chips and LEDs are totally different.There are LED chips factories and LEDs Encapsulation

factories ——- Epistar, Edison, Cree, Bridgelux are commonly used.But be aware Edison and Bridgelux major in LEDs Encapsulation instead of Chips.

Layout Main Enterprises
Japan Nicha, Toyoda Gosei, Sharp, Toshiba, Panasonic
Europe Osram, Philip
USA Cree
Keroa Samsung, LG, Epivalley, Seoulsemiconductor
TaiWan Epistar, AOC, Huga, HL, ED
China Sanan

Different Performances by Epistar and Toyoda Gosei On MCOB LED products

Chips Brand Epistar | Sanan Toyoda Gosei
Power RC IC
Chips From TaiWan Japan
CRI >70RA >80RA
Warranty Years 2 Years 3 Years
Light Depreciation Unstable 1% in 1250Hrs
Quality of wholesale lamps Unstable Stable
Focus Price Quality
Sales Marketing East/Southeast Asia etc. EU/USA etc.
Advantages Profit in a shot time Reputation in future
Technology

MCOB of LED

mcob 1

MCOB of LED light source on Aluminum substrate

6 grooves on Aluminum base ,insulating treatment. Gold foil integrated circuit packaging . Luminous efficacy increased to 130LM/W. However, conductive problem should be paid attention to.

mcob 2

MCOB of LED light source on ceramic substrate

6 grooves on ceramic plate with function of anti-interference and anti-static. Gold foil encapsulation increases LM/W up to 130LM/W. But cost is higher.

mcob 3

MCOB fo LED light source on crystal glass substrate

Silver conducted on SIOX surface. Gold foil encapsulation. 130LM/W . Crystal glass has insufficient heat dissipation

Material Thermal resistance (K/W) Thermal Conductivity (W/mK) Insulativity (KV/mm)
mcobs 1 Aluminum 0.75 225 Non-insulating
mcobs Aloxite 0.3 29.3 22.6
mcobs 3 SIOX 0.3-0.5 0.8-4.5 4-8

MCOB ceramic encapsulation light source

Light Source Thermal resistance (K/W) Thermal conductivity (W/mK) Insulativity (KV/mm)
Aluminum 0.75 22.5 Non insulating
Bergquist 0.3-0.5 0.8-4.5 4-8
Ceramic 0.3 29.3 22.5

Firm structure . High intensity. High insulativity .Anti-corrosion.
Great transmission of light nd>1.8,CRI>80 130lm/w.
Thermal cycles around 50,000 times.
Itchable ceramic surface as PCS board. No pollution.
Working temperature -55°C~+85°C
Coefficient of thermal expansion 0.000003 close to Silicon simplifies production processes.
Tight encapsulation increases power density and improves reliability of system.
Realize new encapsulation ,decreasing the size.

MCOB Aluminum substrate light source

The future trends in LED lighting must be integrated package, this package can improve reliability and reduce costs.

MCOB technology is more than one cup of integrated modular production, MCOB the modular production must be the mainstream of the future, because the modular one can make a relatively large area, and better heat dissipation, the second is can effectively reduce costs.

UNMISTAKABLY:

Internationally leading MCOB LEDs
Illuminant and multiple award-winning designer lamp in one
State-of-the-art LED technology with captivating 1:1 ‘real light’ quality (2,800 Kelvin)
Comes with the previously missed advantages of the classic (25/40/60/75/100)-watt incandescent light bulb
Designed to shine for decades
Instant 100% luminosity
Dimmable bulb with EMC driver
Excellent Colour Rendering Index – Minimal lumen degradation and excellent 80+ Colour Rendering Index (CRI) to optimize pupil lumens and visibility in all conditions. Unparalleled Operational Safety – Negligible electronic pollution. Does not affect electrical and mechanical systems, equipment, sensors and smoke detectors. Lowest possible THD (total harmonic distortion), EMC (Electro magnetic compatibility) and EMI (Electro magnetic interference).
MCOB Light source design & output on Ceramic Base
Thermal Radiation:
By the characteristics of non-hear storing & high thermal conductivity , compared with previous insulating sheet, ceramic substrate decreases the affect with heat efficiency by insulating sheet and performs better at insulating result.

Direct heat dissipation:
Traditional heat management system consists of heating unit →thermal layer →insulating layer→ thermal layer→ Alum heat sink. After the whole getting-through, quantity of heat suffers from attenuation Ceramic sheet with integrated conduction carries off higher heat quantity, not affected by insulating layer.

EMI Test:
Owe to own insulating characteristics, ceramic has better heat management than per unit of Bronze, Aluminum ,reduce and electrical interference and easily pass EMI test.

Application:

LED lighting, high-frequency induction welder, Sound, Driver module, Chip IC, Inverter, Network, UPS power, High-power device.
Ceramic Introduction Parameter

0.7mm thickness ,low value of thermal resistance. Size of 10*10mm =0.31K/W
99% ALNO element
Double-side luminous 330 degree beam angle
1700°C high temperature resistance
Coefficient of thermal conductivity>220W/(m.k)
Thermal conductivity 37 W/(m.k)
Refractive index nd>1.8, higher value, higher efficiency of light extraction
High voltage resistance 13,000 V
Breakdown strength 65kv/mm
High Carrying capacity. 100A current going through copper wire of 1mm width 3mm thickness, temperature increases by 17°C. and by 5°C via 2mm width 0.3mm thickness.
mcob led light chipmcob led light chip

LED Lighting MCOB package technology

LED Lighting MCOB LED Source, that this form results from packaging materials to packaging structures are complete independent intellectual property rights, including the four innovations: the application of the composite ceramic substrate MCOB fo led light source package technology to achieve the LED bulb entire lighting effects 149.97Lm / W color rendering index of 82.5, LED fluorescent light strip overall lighting efficiency 141.2 Lm/ W, color rendering index of 69.8.

LED lighting integrated with a low-cost, high-efficiency improved MCOB package materials and technology achievements appraisal meeting, the group agreed that the appraisal committee of the mcob fo led technology have complete independent intellectual property rights and large-scale industrialization, product technical indicators have reached the international advanced level.

The group agreed that, after long-term basic research, applied research and engineering, the results of design and developed by key encapsulation material, forming a multifunctional modified based on new materials, innovative multi-cup, multi-chip package (MCOB) integration technology, significantly improve the light efficiency, reduce costs, and achieved a major breakthrough for key materials and key technologies with independent intellectual property rights, and achieve economies of scale industrialization.
MCOB fo LED Light Source Package Lighting Technology

LED Light MCOB LED Source form results from packaging materials to packaging structures are complete independent intellectual property rights, including four major innovations:

First, the design and the development of a multi-functional high-reflectance optical ceramic thin film aluminum plate, as MCOB package substrate material, usually silver film yellowing problem, break through the thermal insulation barrier substrate reflectivity and light source efficiency, the simplified package structure, the the lamps total cost MCOB package technology applications the substrate is reduced by more than a quarter. overall lighting efficiency LED bulb entire lighting effect 153.37Lm / W, color rendering index of 82.8, the LED fluorescent light strips 154.72Lm / W, color rendering index of 70.2.

Second, the first to use the combination of the cast composite laminated molding process developed alumina composite ceramic substrate to achieve a high diffuse reflectance and high thermal conductivity, high resistance to electrical breakdown, high reliability and superior performance, and improve the efficiency of the light source a low reflection, low thermal conductivity of the of ordinary alumina ceramic substrate problem solve and optical quality, and application of the composite ceramic substrate MCOB package technology to achieve LED bulb the entire lighting efficiency 149.97Lm / W, color rendering index of 82.5, LED fluorescent light entirety lights The effect 141.2Lm / W, color rendering index of 69.8.

Third, through innovative technology and crystal field modulation technique, prepared at the light wavelength tunable, no surface defects, high quantum efficiency, low light failure, transmission rate close to the theoretical value of a new generation of fluorescent material – garnet structure transparent ceramic phosphor MCOB package using the novel transparent ceramic fluorescent body, and significantly improve the light source reliability and optical efficiency, simplify the package structure, reduce the cost, and resolve the normally present due to aging of the phosphor and encapsulated gum color drift and optical attenuation problems. first raised and the use of double-sided optical package structure, in the low current drive to achieve a multi-chip package structure of the light source light efficiency 261Lm / W.

Fourth, the adoption of improved MCOB LED technology integration (including the above three substrate packaging technology and chip post-processing technology, power technology, the ceramic cooling fin technology, high thermal conductivity of the end of plastic technology) to form a low-cost, high-efficiency LED light source package with lighting technology LED product costs dropped more than a quarter, 50% efficiency, performance leading indicators.

MCOB LED lighting MCOB Light Source

Semiconductor engineering, optical power quality testing, a pragmatic approach to a rigorous test, contained in the safety, optical parameters, electromagnetic interference, 3,000 hours attenuation can be considered a complete range of testing.

Text Results ( Measured Data)
Item Unit Value
Original Illuminance Lux 583.45
Final Illuminance Lux 590.45
Illuminance attenuation % -1.2
Original Tc K 5588
Final Tc k 6033

By MCOB LED Lighting production of LED Bulbs, LED Tubes, LED Spotlight, LED candles is a self-developed MCOB light, the light source using a unique technology roadmap, posted straight cooling technology and independently developed BOSS end of plastic, so that heat can be distributed in the shortest possible speed, in order to to ensure that the 3000 hours of zero attenuation possible, the technical indicators, far ahead of the other products of the parameters measured; the luminous efficiency and the test of as 100-130LM / W, significantly refers to 80, but also for the international similar the products of the highest indicators, all indicators are in line with national testing standards.

Led Lighting technology of Multi-Chips/Cups on board acheives 100LM/W-130LM/W luminous efficacy, considered as the4th generation light source.

Unique MCOB encapsulation and amazing cooling technology of LED dies to make sure a long lifespan of LED Chips, excellent heat dissipation and stable performance.

LED lamps are highly protected with surface treatment for anti-UV and aluminum die-casting for water-tolerant and durability.

Besides the stunning energy effect, MCOB MCOB ecapsulation prmoises less than 80¡ãC working temperature for LED chips.After 50,000 working hours, the luminous flux maintains a high level.

MCOB Packing adopts dies directly embedded technology and Boss primer to spread the heat in a short route, which finally promise the possibility of light depreciation ahead othe LED lights. This is also the highest index internationally in compliance with relevant test standard (Including Safety,Electric parameter, EMC, 2005/32/ECetc.)

MCOB LED technology is more than one cup of integrated modular production, but I am more convinced that the modular production must be the mainstream of the future, because the modular one can make a relatively large area, and better heat dissipation, the second is can effectively reduce costs.

Our technology is modular production. I consider that we are always in the implementation of a high-power direction of development is not necessarily correct, because the high-power light luminous efficiency must be better than the small chip light-emitting efficiency is low, at least 5% lower. The second area of high-power chip, with a small chip compared to, for example, at the same time a tile, a small chip area must be better than the high-power area, heat dissipation, small chip must be better than the high-power cooling. The more obvious is the small chip can significantly reduce costs, and low-power chip is fairly stable, high-power chips for our country in terms of a certain degree of difficulty, of course, many companies said the high-power to do good and do well there is a great cost, to the contrary, the small chip, the more businesses can do better. So I can determine stresses, low-power integrated should be the future of the mainstream.

In addition, with the production of large quantities of small chip cost will be relatively large decline in the space. I believe the next day, do not for a long time, LED lighting can achieve the same energy-saving lamps or a little higher price. Although we think that the price of LED lighting and energy-efficient lighting as impossible, but waiting for us and the Chinese Academy of Sciences of the technology has introduced, it should be said can be achieved within 3, 5 years LED lighting costs and the cost of energy-efficient lighting or is slightly higher than a little bit.

LED Chips Manufacturers

As the core unit, LED Chips technology’s development leads the direction of LED Lighting market. Currently there are 3 groups in this market,performing “Matthew effect”.

The first Group: (Japan,Europe,America as the representatives)

5 biggest Chips Manufactuerers: Philip/Lumileds(Netherland), Cree(America), Nicha(Japan), Toyoda Gosei(Japan), Osram(Germany), Also Sharp ,Toshiba, Panasonic included.

The Second Group: (Taiwan, Korea as the representatives)

Sanan ——- Chips and LEDs are totally different.There are LED chips factories and LEDs Encapsulation

factories ——- Epistar, Edison, Cree, Bridgelux are commonly used.But be aware Edison and Bridgelux major in LEDs Encapsulation instead of Chips.

Layout Main Enterprises
Japan Nicha, Toyoda Gosei, Sharp, Toshiba, Panasonic
Europe Osram, Philip
USA Cree
Keroa Samsung, LG, Epivalley, Seoulsemiconductor
TaiWan Epistar, AOC, Huga, HL, ED
China Sanan

Different Performances by Epistar and Toyoda Gosei On MCOB LED products

Chips Brand Epistar | Sanan Toyoda Gosei
Power RC IC
Chips From TaiWan Japan
CRI >70RA >80RA
Warranty Years 2 Years 3 Years
Light Depreciation Unstable 1% in 1250Hrs
Quality of wholesale lamps Unstable Stable
Focus Price Quality
Sales Marketing East/Southeast Asia etc. EU/USA etc.
Advantages Profit in a shot time Reputation in future

LED lighting technology comparison
MCOB LED Comparison COB LED Comparison High power LED Comparison SMD LED Comparison T-type LED Comparison

Single Layer Aluminum Plate Big LED Chip on 3 Layers Plate High Power Chip on 3 Layers Small LED Chip on LED Pin On PC Board

100 lm/w – 140 lm/w

70 lm/w – 90 lm/w

60 lm/w – 80 lm/w

70 lm/w – 90 lm/w

60 lm/w 70 lm/w

Silicone Chips are applied directly on the aluminum plate allowing for up 97% heat dispersion

with IC-tpye Power Supply

Larger silicone Chips are welded the same way as on the 2nd generation surface mounted device, with 50% heat dispersion.

with 2or4 pins welded on single-sided PCB. Patent of LumiLED for multi-angle emission by optical lens .

Most of high power chips are called “Copy LumiLED”

Silicone Chips are welded on to a 3layers aluminum plate resulting in higher cost with only 50% heat dispersion.

Lighting Structure is made up of many pins on a PC board to achieve good lighting effect but with poor heat dispersion from multiple pin.